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Untitled Document

TRSYS01(KGT-100)
High accuracy thermal resistance measurement system with 2 measurement locations
TRSYS01 specifications:
Test method ISO 9869 and ASTM C1155 / C1046
Measurement locations 2 (can be increased on request)
Power requirements 110-220 V, 0.5 Watt (max)
Differential temperature (¥ÄT) matched pairs thermocouple type KX, 584.3:1989
¥ÄT accuracy 0.1 degree C
Heat flux sensor type HFP01
Protection sensors and MCU IP 63
Cable length 20 m (3x) and 10 m (3x)
Storage capacity > 30 days of data: 10 minute and 24 hour averages
Data analysis to be performed by the user according to ISO and ASTM standards
TRSYS01 is a measurement system for analysis of thermal resistance and thermal transmittance of building elements by in-situ measurement. It can be used for measurements according to ISO 9869 and ASTM C1155 / C1046 standards. In its standard configuration the system is equipped with two heat flux sensors as well as two pairs of matched thermocouples for differential temperature measurements.

A nice clear print of the original product brochure.

Introduction
The in-situ measurement of thermal resistance, thermal transmittance or U-Values of buildings is often applied in studies of building elements.

The thermal resistance, TR, measurement is based on simultaneous measurement of time averaged heat flux F (using a heat flux sensor) and differential temperature, ¥ÄT, (two temperature sensors).

TR = ¥ÄT / F

The ISO and ASTM standards on the subject comment on applicability of the method, on installation and on data analysis.

The TRSYS consists of high accuracy electronics (measurement accuracy up to 1 microvolts) as well as matched thermocouple pairs to make a differential temperature measurement with a better accuracy than 0.1 degrees C. It also includes HFP01 heat flux plates. HFP01 is the world's most popular sensor for heat flux measurement through building envelopes.


TRSYS01 consists of MCU Measurement and Control Unit (1), an adapter for power (2), 2 pairs of matched thermocouples (4), and 2 heat flux plates of type HFP01 (5). MCU measures and stores data. Readout is performed by connecting temporarily to a PC (3) (not included). Software for readout is included.
Options
LP02 solar radiation sensor
Integrated battery pack
Version 0620

Reference users are:

ABB Group-Switserland, Aker Solutions-Norway, Akzo Nobel Coatings BV-The Netherlands, Alstom-France, Areva-France, Bluewater-The Netherlands, Bredero shaw-Italy, Castrol-United Kingdom, Ceast-Italy, DSM-The Netherlands, EGS Americas inc.-United States of America, Extrugroup-The Netherlands, Fire research centre Lithuania-Lithuania, Gardline Group-United Kingdom, Huntsman Holland BV-The Netherlands, ICP France SAS-France, Isovolta Group-Austria, Jotun Group-Norway, Kema-The Netherlands, Labo Service-Belgium, Mapper Lithography-The Netherlands, Medcon Construction ltd.-Cyprus, Metallic Power inc.-United States of America, NRC-Canada, O and G industries inc.-United States of America, PE Composites ltd.-United Kingdom, Phototherm-Germany, Polymatech-Japan, Prysmian Cables & Systems-Italy, Raisio-Finland, Rhodia-France, Shell-The Netherlands, Surface Optics Corporation-United States of America, Toray-Japan, Toshiba Corporation-Japan, Trespa Inernational BV-The Netherlands, TU Delft-The Netherlands, University Firenze-Italy, US Heat-United States of America, Wroclaw Technical University-Poland.

  

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